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CPU | Intel ® Core ™ 11th generation H-series processors | Post I/O interface | 1 * DCIN 1 * DP+HDMI port 1 * DP+DP port 2 * USB3.0 port 1 2 * USB3.0 Port 2 (1 * LAN optional) 1 * LAN port 1 * MIC-IN interface 1 * LINE OUT interface |
Chipset | Intel® MH570 | ||
Display chip | Intel ® integrated graphics | ||
Display output | DP/HDMI/LVDS/EDP | ||
Multi display support | Any four sets of four displays (copy, expansion mode) | ||
USB | 4*USB2.0 ;4*USB3.0 | Internal I/O | 1 * LVDS pin 1 * EDP socket 1 * SPEAKER pin 1 * GPIO pin 2 * SATA_ Port 1 * SATA_ PWR 2 * USB2.0 pin (expandable 4 * USB2.0) 1 * 4PIN ATX 1 * F_ AUDIO pin 1 * F_ PANEL pin 1 * eSPI pin 1 * BKCL pin 1 * CLR_ CMOS jump cap 1 * PWR_ EDP Jump Hat 1 * LVDS_ EN jump cap 1 * JME jump cap 1 * AUTO_ ON jump cap (self start when powered on) 1 * C_ FAN 1 * S_ FAN |
Memory | 2*SO-DIMM DDR4 3200MHz Max64GB | ||
sound effects | On board Realtek ALC269HD audio decoding controller | ||
Network card | On board 1 * Realtek RTL8111H Gigabit Ethernet card (optional dual network) | ||
storage | 2*SATA Port; 1*M.2 M Key (Supports Pcie X4 and SATA SSDs) 1*mSATA | ||
expansion slot | 1*M.2 E Key(support Pcie X1、WIFI/Bluetooth) | ||
I/O chip | IT8613E | ||
BIOS | AMI BIOS | ||
power supply | DC 12~19V power supply | ||
Cooling System | Requires self equipped 115X CPU heat sink | ||
Environment | Working temperature: 0-60 ℃; Storage: -20~75 ℃ | ||
0%~95% relative humidity, non condensing | |||
Size | 170mm X 170mm |